How Semiconductors Are Made
IC Manufacturing Process The IC manufacturing process can be divided into three phases.
Click a process to learn its details.
Design / Mask Creation
During the “design / mask creation” phase, the function of the IC is defined, the electric circuit is designed, and a mask for IC manufacturing is created based on the design.
Front-End Processing (Wafer fabrication)
During the front-end processing phase, an IC is created on a silicon substrate (referred to as a “wafer”).
Back End Processing (Assembly/Testing)
During the back-end processing phase, the IC chips created during the front-end processing phase are encapsulated into packages, and thoroughly inspected before becoming completed products.
This procedure is used for the formation of a circuit pattern during various front-end processes.
Device Formation / Device Insulation Layer Formation
A device insulation layer (field oxide-film) is formed for electrical isolation of the devices.
  Back End Processing
Device Formation / Transistor Formation
Transistors are formed in the active regions to control the flow of electrons.

Devices, such as transistors, are interconnected to form an electronic circuit.



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