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During the “design /
mask creation” phase,
the function of the IC is defined, the
electric circuit is designed, and a mask for IC manufacturing is
created based on the design. |
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During the front-end processing phase,
an IC is created on a silicon
substrate (referred to as a “wafer”). |
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During the back-end processing phase,
the IC chips created during the front-end processing
phase are encapsulated into packages, and thoroughly
inspected before becoming completed products. |
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This procedure is used for the formation
of a circuit pattern during various
front-end processes. |
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A device insulation layer (field oxide-film) is
formed for electrical isolation of the
devices.
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Transistors are formed in the active regions to control the flow of electrons.
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Devices, such as transistors, are interconnected to form an electronic circuit.
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This site guides you through
the manufacturing process with
narrations and Flash
animations.
• The narrations can be turned OFF.
• This site requires the lastest version
of Macromedia
Flash Player.
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