Two new power MOSFETs form a chipset for DC/DC converters used in servers, notebook PCs, telecommunications devices, and the like. The high-side RJK0305DPB and low-side RJK0301DPB devices are ideal for circuits that convert a 12 or 19V input into 0.8 or 2.5V output. They are manufactured using a newly developed process optimized for power-supply applications. As a result, the MOSFETs can increase converter efficiency. For example, when they are used in a DC/DC converter that has an input voltage of 12V, an output voltage of 1.3V, and an output current of 20A, the MOSFETs boost the efficiency to over 90%, compared to the 87.5% achieved with previous-generation devices. Power loss is reduced by about 22%, from 3.7W to 2.9W. This enables an increase of approximately 15% in the output current of the power-supply without changing the heat-radiation parameters.

The RJK0305DPB high-side power MOSFET has an inter-drain-gate power load (Qgd) of about 15% less than conventional products, for faster switching speed. The RJK0301DPB low-side device has about 20% lower on-resistance than conventional products, for reduced conduction loss. Both devices have an LFPAK package with high heat-radiation capabilities and low inductance, enabling improved current control.

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The DVP-MW (model # R8J66607FP) is a new flagship product in our Digital Video Processor-Multi (DVP-M) series of signal-processing LSIs for LCD televisions. The single-chip solutions in this series perform major signal processing, from early-stage signal input to signal output to the liquid-crystal panel and other late-stage processes. They combine this capability with video decoder and text-broadcast support features compatible with every broadcast method in the world.

The DVP-MW has a built-in dual screen display feature, which is in high demand for screens in the 26-inch class and larger. It provides a wide array of built-in display features, including Double Window, in which two screens are shown side by side; Picture In Picture, in which a sub-window appears inside the main screen; and Picture Out Picture, in which a window appears on a separate screen outside the main screen. Additionally, a built-in pause feature enables one of the screens to be frozen when two screens are being displayed.

The new signal processor retains pin-layout compatibility with existing products in the DVP-M series, while providing forward compatibility in functionality. This facilitates upgrading from currently popular 13- and 22-inch class systems to 26-inch class TVs and above. It also helps reduce product development time and costs by allowing the same system substrates and software to be used for multiple models in a product line.

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Two new First-In-First-Out (FIFO) memory chips with high 8Mbit capacity and fast 100MHz speed can improve serial data storage in W-CDMA and other mobile-phone base stations, digital home electronic appliances, color copiers and other office equipment, etc. The 100-pin R8A66120FFP and 48-pin R8A66120FFA use improved memory cells and control circuits to obtain a 33% increase the memory capacity compared to our previous-generation 6Mbit products, as well as a 25% increase in maximum clock speed, from 80MHz to 100MHz.

The 100-pin R8A66120FFP is equipped with multifunction FIFO features, making it possible to flexibly switch word count (depth) and bit width (I/O bus width) in accordance with the system application and architecture. It can be configured as 256K words x 16 bits x 2 lines (mode 1), 512K words x 8 bits x 2 lines (mode 2), or 1024K words x 4 bits x 2 lines (mode 3). The 48-pin R8A66120FFA is designed to offer a smaller mounted footprint on the substrate (7 x 7mm) and has a 1024K words x 4 bits x 2 lines configuration.

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The AE55C1 microcontroller for smart cards, finance, ID, and other applications has a high-performance 32-bit 20MHz AE-5 CPU core, 40Kbytes of EEPROM, and 240Kbytes of mask ROM. Compared with chips that have an AE-4 core, the new device delivers approximately four times the processing power. The command set of the AE-5 core is forward compatible, so programs developed for devices with the AE-4 core can be used as-is.

To achieve strong security features along with higher performance, the AE55C1 is equipped with a Direct Memory Access Controller (DMAC) peripheral that supports high-speed communications. It also provides an enhanced coprocessor for exponential remainder operations for encryption functions.

Development tools from Renesas include the E6000H full-featured emulator and the SE-I streamlined emulator. The microcontroller can be shipped in wafer or chip-on-tape (CoT) formats.

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The R61505 LCD controller-driver with onboard nonvolatile memory is a single-chip solution for amorphous TFT color LCD panels in mobile phones. It supports QVGA-size screens with resolutions of 240 x 320 pixels and enables 260K color displays via approximately 172Kbytes of onboard display RAM. It can replace the two controller driver chips used in older LCD panel modules, saving cost and board space. Because it has a built-in 10bit write-only nonvolatile memory, it can also reduce the external memory previously needed for storing image-quality calibration data, shipping control data, etc.

Offering a wide drive-voltage range (4.5 to 6.0V), the R61505 device supports wide view-angle panels. It offers a hardware power sequencer to control the startup sequence of LCD drive power. Features for reducing power consumption include an 8-color display mode, standby mode, and deep standby mode. The controller-driver can be assembled in a phone display module using the Chip-on-Glass (CoG) mounting method.

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